Electronics Forum: 0402 pads (Page 1 of 21)

0402

Electronics Forum | Tue Jun 07 16:25:29 EDT 2005 | davef

We use a 0.012 inch gap betweem 0402 pads.

0402

Electronics Forum | Tue Jun 07 15:00:10 EDT 2005 | glenda

what about spacing between pads center to center on 0402.

0402

Electronics Forum | Thu May 29 16:37:57 EDT 2008 | aj

10% reduction on 5 thou. Gap between pads is also critical with 0402's.

0402

Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo

Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen

0402

Electronics Forum | Thu May 29 17:19:51 EDT 2008 | dyoungquist

On 0402s we use 20x25 mil pads with a 15 mil gap between the pads on the pcb with ENIG finish, 5 mil stencil with a 1:1 aperture (20x25 mil) and SAC305 lead free solder paste. We very rarely see any tombstoning on 0402s using this setup.

0402

Electronics Forum | Tue Jun 07 19:24:44 EDT 2005 | russ

We use a .010" - .012" gap with .020" square pads.

Component 0402

Electronics Forum | Mon Sep 20 16:46:47 EDT 2004 | cristiano

Do you have any information about the best standart for 0402" chip pad design. I have found differents recomended dimensions from IPC standart and manufacturer(AVX) . Which should be the best one? Thanks

0402 tombstoning

Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect

We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

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