Electronics Forum: 0603 and aperture and pitch (Page 1 of 5)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Fuji CP3 and 2mm pitch tape

Electronics Forum | Tue Jan 14 15:38:28 EST 2003 | fujispares

Hi, CP3 will have trouble placing 0603 parts - I wouldn`t use a CP3 for these parts - A CP4 will be more suitable. A older CP4 feeder will fit and function on a CP3.

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno

Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef

People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

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