Electronics Forum: 0805 and pad and design (Page 1 of 9)

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef

For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills

Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said

Component pad design and volume requirements

Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a

0402 pad and stencil aperture design

Electronics Forum | Fri Oct 31 07:52:23 EDT 2008 | davef

For a better understanding of decoupling capacitors, look here: * http://en.wikipedia.org/wiki/Decoupling_capacitor * http://www.hottconsultants.com/techtips/decoupling.html * http://pcdandf.com/cms/content/view/3410/95/

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 15:36:18 EDT 2008 | grantp

Hi, Sounds like your engineer does not know what he's doing. We have developed and built hundreds of thousands of boards with normal square pads for 0402, and we just use a 5 thou stencil with 5% reduction and it works well. Decoupling? What is tha

uBGA PCB design and stencil design

Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris

Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 23 12:33:37 EDT 2019 | ameenullakhan

Hi , Its CCGA part . with normal PCB pad opening similar to other BGA pad . Yes its very surprising and we are not able to analyze. What exactly went wrong. We have new stencil design for this now. Will run it tomorrow. Will update the results.

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788

Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef

You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.

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