Electronics Forum: 1


Electronics Forum | Mon Apr 04 22:07:15 EDT 2005 | Dhanish

Questions and answers - what Column pitch do your CCGA have ? a) 1,27 mm?b) 1.00 mm? 1.27mm - how are the PCB pad finisched ? OSP Enig? HAL? OSP - Are you using Clean or NC solder paste? Clean

CSP No clean residue

Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef

KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.

Philips CSM

Electronics Forum | Sun May 18 19:04:54 EDT 2008 | jmelson

OK, here's a sample component file : 1 0.1uF 0.00 1 24 1.00K 0.00 1 22 10.0K 0.00 1 3 1000pF 0.00 1 3 .001uF 0.00 1 25 1.0uF 0.00 1 2 100pF 0.00 1 30 10M 0.00

Yamaha YV100XT

Electronics Forum | Sun Oct 17 09:25:46 EDT 2004 | raj_nz


FPGAB Adapter

Electronics Forum | Mon Jan 20 01:46:24 EST 2003 | Claudia

I am looking for a FPBGA adapter (pin 256 pitch 1.00mm size 17mm x 17mm). We need the adapter to interconnect the FPBGA from the handset board to a SW test board. Question: Where can I find BGA adapter with different heights? What do we have t


Electronics Forum | Mon Apr 04 18:23:35 EDT 2005 | GS

Solder volumes is very important parameter to keep under control in order to get a good and reliable CCGA solder joint, and an automatic 3D paste volume inspection is strongly recommended practice to use. Questions: - what Column pitch do your CCGA h

Need info on Vitronics XA0820 - XN1030

Electronics Forum | Sat Dec 17 14:14:32 EST 2011 | shakerbose

We currently have several Vitronics Re-flow Machines, and I would like to know if I can move software V.10.01.00 from a XN1030 to a XA0820 machine running V. 08.00.00. Both machines have the same Controller Hardware Version A32.1.00

Re: QP2 vs GSM

Electronics Forum | Wed Jun 10 17:30:44 EDT 1998 | FAC

When creating part data�s for BGA or QFP style components, the line scan camera will be utilized (Camera No. 4). Using a Single nozzle type placing head, a nozzle capable of sufficient vacuum, and front lighting the part can achieve placement of a 74

Silicon contamination in solder joint

Electronics Forum | Wed May 28 14:35:47 EDT 2003 | davef

Wow, you're very correct. I guess we use silicone to calibrate our machine, as follows: XPS spectral measurements of dimethyl silicone should include O(2s) at 25 eV, Si(2p) at 102 eV, Si(2s) at 153 eV, C(1s) at 285 eV, and O(1s) at 533 eV. The C(1s

Help for replacing BGA with metal heat sink

Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele

Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a

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