Electronics Forum: 1

Why 50 mils in 0805 package instead of 40 mils.

Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef

EIA standard packages have a variety of L/W proportions. EIA Dimension mm (LXW) Proportion (L/W) 0201 0.6X0.3 2 0202 0.5X0.5 1 0303 0.8X0.8 1 0402 1.0X0.5 2 0504 1.25X1.0 1.25 1.4X1.4 1 0603 1.6X0.8 2 0805 2.0X1.25 1.6 1111 2.8X2

CSP No clean residue

Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef

KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.

smt sizes

Electronics Forum | Fri Dec 31 03:04:24 EST 2004 | Colin G

0805 is 80 thou by 50 thou. As there are 40 thou per mm, this is therefore a device which is 2mm by 1.25mm, i.e., a 2125 Cheers, Colin...

PCB Fab House

Electronics Forum | Thu Apr 03 15:17:35 EDT 2008 | lakeside

Hi John, Check out Sierra Proto Express: http://www.protoexpress.com They have a microelectronics division that can do the 4 mil laser drill & they can get down to 1.25 mil space/trace. Hope they can help! Julie

How to prevent COB pad free from contamination

Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117

Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to

HASL lead free thickness

Electronics Forum | Wed Nov 17 07:39:20 EST 2010 | jax

Most PCB manufacturers should be able to fall between 1.25um-5.00um for Pb-Free HASL. I doubt you will get anyone to agree to anything higher. If you are going to require an average thickness, make sure you also state "No Copper exposure allowed".

What is your highest Reflow Speed?

Electronics Forum | Fri Jun 20 08:04:21 EDT 2014 | emeto

0.8m/min is a different story. I run my 10 zone reflow ovens with that speed all the time and never had a problem. For the short profile I mentioned the speed I used is even higher(about 1.25m/min). No issues with parts moving. Regards, Emil

Help for replacing BGA with metal heat sink

Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele

Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a

Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen

I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon

I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau

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