1,25

"1,25" search results in the Electronics Forums



41 results found for "1,25" in the Electronics Forums

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DEK Printer File Format

Jun 15, 2018 |

Conformal Coating

Nov 1, 2011 |

solder paste

Jul 27, 2011 |

HASL lead free thickness

Nov 17, 2010 | Most PCB manufacturers should be able to fall between 1.25um-5.00um for Pb-Free HASL. I doubt you wi

Philips CSM

May 18, 2008 |

PCB Fab House

Apr 3, 2008 |

Capacitor Failure

Apr 26, 2006 |

Internal Oven Calibration

Feb 13, 2006 |

SMEMA conveyor

Oct 16, 2005 |

smt sizes

Dec 31, 2004 |

CSP No clean residue

Dec 8, 2004 | KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The

BGA PROCESS MATERIAL

Feb 20, 2004 | We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, bec

0402 stencil design

Feb 4, 2003 |

Part sliding in reflow?

Apr 17, 2001 |

Waverider

Jun 7, 2000 |

Help-Wire Bonding Defects Analysis After Encapsulation

Dec 3, 1998 | | | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulati

Help-Wire Bonding Defects Analysis After Encapsulation

Nov 27, 1998 | | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation

Help-Wire Bonding Defects Analysis After Encapsulation

Nov 27, 1998 | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation,

Help-Wire Bonding Defects Analysis After Encapsulation

Nov 27, 1998 | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation,

Help-Wire Bonding Defects Analysis After Encapsulation

Nov 26, 1998 | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I

Help-Wire Bonding Defects Analysis After Encapsulation

Nov 26, 1998 | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do

Led testing color sensors

Industry 4.0 Reflow Oven