High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Improued Flexibility -Machine heads can be configured for high mix production WIth the new designed RX-6R placement speed is improved 24% from previous design. Juki is commotted providing a high speed,high quality flexible solution.
Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef
EIA standard packages have a variety of L/W proportions. EIA Dimension mm (LXW) Proportion (L/W) 0201 0.6X0.3 2 0202 0.5X0.5 1 0303 0.8X0.8 1 0402 1.0X0.5 2 0504 1.25X1.0 1.25 1.4X1.4 1 0603 1.6X0.8 2 0805 2.0X1.25 1.6 1111 2.8X2
Nicely maintained glue dispenser loaded with accessories. 642 pump. Travel X-axis: 19.00" (483mm) Travel Y-axis: 19.00" (483mm) Travel Z-axis: 1" (25mm) Resolution: 0.001" (25 microns) Repeatability: +/-0.002" (+/-50 microns) with linear motors
Industry News | 2012-02-23 15:35:35.0
The SMTA Capital Chapter is pleased to announce the upcoming SMTA meeting. During this first meeting of 2012, Cleve Williams, an industry expert with more than 20 years of electronics manufacturing experience, will share his knowledge and expertise on AOI Solder Inspection.
Industry News | 2011-04-22 21:54:12.0
The Capital Chapter is announcing its next SMTA meeting to be held at APL, Johns Hopkins University, in Laurel MD on May 17, 2011 from 5pm-8pm.
Tenryu 7100 nozzle I-PULSE k05 nozzle Tenryu 7100 nozzle I-PULSE nozzle pick up nozzle Part Number Description K01 FV-7100 PICK UP NOZZLEø0.65/ø0.45 K02 FV-7100 PICK UP NOZZLEø0.9/ø0.65 K03 FV-7100 PICK UP NOZZLEø1.3/ø0.7 K04 FV-7100
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
03041087S01 TOOTHED BELT Synchroflex 2,5T5/1440 03041172-01 Assemblykitt SST34 X-Serie 03041242-01 Protection foil X-Trail outside 03041473-03 Modul / 1-Wire Hub CAT 5 03041529-01 RETROFIT KIT FIXING TRANSPORT HS 03041562S01 Lig
0.75 50 OD x 20 0.20 5 3 7 30 44 66 97 3 OD x 1 75 OD x 20 0.30 7 6 13 68 100 150 220 4 OD x 1 100 OD x 20 0.35 9 13 29 122 177 268 389 5 OD x 1.25 125 OD x 30