Electronics Forum | Mon Aug 06 10:41:42 EDT 2001 | Stefan Witte
In order to program your board, you are not exposed to the operating system. If you want to "talk" to a Windows machine via LAN, you will have to install a communication software either on the Windows machine ( disc access ) or on the Linux machine
Electronics Forum | Fri Aug 10 13:30:46 EDT 2001 | mzaboogie
Good Afternoon. Hope all is well with everyone. > I was wondering, What is the preferred equipment > to use for BGA rework/replacement and xray? I > would like to know what equipment you are using > and your likes/dislikes of the equipment.
Electronics Forum | Thu Aug 16 10:49:35 EDT 2001 | JohnW
Dave, we try and keep the temperture that a BGA is exposed to at wave solder below 150 deg C. At this temperature it's unlikely that you'll get near to starting secondary reflow of the device or that you'll grow any significant amount of intermetall
Electronics Forum | Fri Aug 10 04:19:05 EDT 2001 | wister
There are lots of voids at solder joint of chips,the thickness of multilayer pcb is 3.2mm,top side have lots of chip component and bottom side has several BGA and QFPs.For top side profile,the preheat time is about 100s,soak time is about 75s,time ov
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Mon Aug 13 05:17:16 EDT 2001 | nifhail
Normally the specs I monitored in our temperature profiles are Slope 1-2 Deg C/sec, preheat 60 - 120 Sec at 120 Deg C - 150 Deg C, peak 215+/- 10 Deg C, above 183 Deg C is 45 - 75 Sec, total reflow is 3 - 5 minutes. Why is it that we don't monitor
Electronics Forum | Thu Aug 16 13:46:06 EDT 2001 | Hussman
Hi Pavel, I'll bet you're talking after reflow - so in a nutshell - it is too much solder. Paste goes under the R or C and rests on the mask after placement. During reflow, this excess paste balls up along your part (wow, look Ma, no rocket scienc
Electronics Forum | Mon Aug 27 09:56:00 EDT 2001 | stefan
I wonder what kind of equipment the board designer had in mind? Are you shure you can do the board with a Mydata ? Where do you put the tray for your 20 mil QFP's? 10 mm thick plus component height also appears to be a problem. Multitroniks can do la
Electronics Forum | Sat Oct 06 08:36:04 EDT 2001 | davef
Your point about thermosets getting soft in the preheater of the wave is well taken. But an adhesive that is used past its expiry or other up-front lack of process control represent 99 & 44/100 percent of the reason for �glued parts falling off in
Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua
Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &
