Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000
I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i
Electronics Forum | Thu Aug 06 19:20:09 EDT 2009 | boloxis
easy, just dip the ICs on a very weak solution of Nitric Acid, by very weak I mean like drops of Fuming Nitric acid in a half full DI water beaker. Place the beaker on a Ultrasonic bath and dip/shake the ICs in the solution in 5~ 10 seconds only. You
Electronics Forum | Tue Aug 04 10:36:28 EDT 2009 | kpm135
I haven't been able to access any old forum posts. Searching gives me a selection of old posts but every time I click on one I get the following screen: Internal Server Error The server encountered an internal error or misconfiguration and was unab
Electronics Forum | Tue Aug 04 10:19:38 EDT 2009 | swag
Here's a few ideas: If it has one, make sure the flexible coupler set screws are tight. Replace the tactile switch (often these appear to work fine in I/O but do not work properly in production). Clean and oil the tactile plunger if it has one. M
Electronics Forum | Tue Aug 04 10:43:48 EDT 2009 | kpm135
Thanks for the suggestions! It ended up being that a wire on the amplifier card in the lower drawer came loose and was making intermittent contact. Tightened all the wires down and the problem has gone away. Now we have a new problem. We had to repla
Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Tue Aug 18 02:10:14 EDT 2009 | sergey2007
Hello, I have a customer who recentely installed a vapor phase soldering system. Everything goes pretty well, but from time to time the customer has the same problem with the soldering: one of the components on PCB (usually, it's a QFP package) is ro
Electronics Forum | Wed Aug 19 15:24:21 EDT 2009 | smt_guy
I have a customer who approved and asked us to process PCB's built with Lead-Free HASL Finish using Eutectic Solder. We did as directed and inspected the result from a 10-PCB Run and couldn't find any problem with solderability or issues. What Issue
Electronics Forum | Mon Aug 24 10:35:54 EDT 2009 | rossi
I don't think its an issue with the PCB. When we just put the paste down and not the BGA the solder paste seems to adhere to the PCB pads very well (not brittle). Also we have other very similar PCBs that we run different normal silver content BGAs
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