Electronics Forum: 10 (Page 1621 of 1925)

Trouble with wave solder pallet

Electronics Forum | Wed Jan 12 21:37:04 EST 2005 | KEN

How thick is this pallet? 6mm, 8mm, 10mm? I would look at: Make sure you're pot height is correct (lead clearance). If you are burrying the pallet in the fountain, your going to "push" a large volume away. The solder "push" should not plow over t

Lead free profile

Electronics Forum | Tue Feb 01 09:54:23 EST 2005 | jbrower

Hi Frank, we're still going to go with FR4 as our prefered material. Our board thickness is .062. We use an on shore and off shore vendor. Prototron I believe offers an immersion tin and excellence in china? offers an immersion tin finish. We fou

Lead free profile

Electronics Forum | Sat Feb 05 23:54:37 EST 2005 | sms_don

Hello, I found the previous discussion of lead free profiles on 5 zone ovens very interesting. I had the same concerns, but have recently succeeded in creating profiles on a 5 Zone QUAD oven that have eliminated solder splatter or Solder on Gold w

used mydata equipment

Electronics Forum | Thu Feb 10 14:27:07 EST 2005 | cyber_wolf

First of all, whom are you getting it from ? Mydata, or a used equipment broker. If you can tell me what machine type you are looking at, then I can tell you what to look for. (MY-series, or TP series) Most important things right off the bat: *Machi

Reball BGA process flow

Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ

Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply

Lead Free Substrate

Electronics Forum | Wed Feb 02 22:10:30 EST 2005 | T2

Higher Tg values are only one thing to look out for. Two other things that are very important to watch are the Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down), and the CTE for the material. Some Tg 14

Traceability

Electronics Forum | Tue Feb 08 10:55:56 EST 2005 | Dreamsniper

Hi, Can you guys give me a heads up on "Traceability". I find it to be a stumbling block in my process and delays my manufacturing throughput big time. I wanna have a clear understanding of when you need it, why you need it and how will you benefit

Lead contamination in wave solder pot...

Electronics Forum | Wed Oct 12 11:19:46 EDT 2005 | patrickbruneel

Yeah, adopting is the right word. In this new lead-free era spec.'s are made to stay within the scoop of the RoHS directive. The driving force for spec.'s should be reliability. Did you see any impurity level spec.'s yet in wave soldering for Cu, Au,

Set Command Variables

Electronics Forum | Wed Feb 09 10:32:49 EST 2005 | primus

Hello there! I am familiar with the Set Command Variables available on our older UIC through-hole machines, and am investigating the possibility of making these variables available to our operators. Over the past years, our operators have been train

Sudden paste release problem

Electronics Forum | Thu Feb 10 09:30:32 EST 2005 | cyber_wolf

I am curious as to why you are using Koki ? Why are you not using a main stream paste that is proven in the industry? Indium,Kester,Multicore,AIM.... It has been my experience that when you start having paste-releasing problems out of the blue, it


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