Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
Electronics Forum | Fri Oct 22 19:34:56 EDT 2010 | hegemon
Thanks for the help guys. Nice to think I was basically on the right path. PCB manufacturer has finally conceded the barrel defects and is remaking the PCBs. We are big on pre-tinning the leads of TH connectors as well as providing some good pre
Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok
OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun
Electronics Forum | Thu Oct 21 12:44:07 EDT 2010 | swag
We issue extra parts like this: 8/2 caps and resis. - 40 over 8/4 caps and resis. - 20 over 8/4 IC's - 7 over 12mm - 7 over larger feeders + stick + matrix = the correct # req'd. These #'s were based on our first SMT lines (used equip.) and we made
Electronics Forum | Fri Oct 22 18:57:25 EDT 2010 | jry74
I am having a horrible time with the square radial lead capacitors (thru hole components) and the part coating flowing into the solder joint. These are Class 3 products. When we run them through the wave solder machine, the solder travels up the le
Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1
We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea
Electronics Forum | Thu Jan 13 10:30:40 EST 2011 | bdamico
Hello Scott, Simply program the side angle cameras as you would for any other device using the downward camera. For instance, solder joint inspection for a PLCC would utilize a basis window, bridge inspection algorithm and individual solder joint i
Electronics Forum | Fri Dec 17 10:42:58 EST 2010 | hegemon
I believe there is a lot pertinent information in the thread that Dave forwarded... But (IMHO)I think you can look at two things first. First, is your wave solder process friendly to this large PCB, is there enough pre-heat in the board before it h
Electronics Forum | Wed Dec 15 15:07:41 EST 2010 | remullis
I have used Unicam software to create visual workaid documentation along with a setup sheet showing BOM in relation to feeder setups, etc. This was used in 1st piece verification, but also in the early days I had to do a 2 person validation. One and
Electronics Forum | Tue Jan 04 09:26:22 EST 2011 | scottp
We've been doing this for over 10 years using flux. We print a tacky flux first using an 0.002 or 0.003" thick stencil, then print paste using a thicker stencil with the underside half etched to keep it away from the flux. In our case, we can't jus
