Electronics Forum | Fri Oct 29 10:44:35 EDT 1999 | Doug Nebel
We have placed them before. You can only inspect the perimeter, but with the larger pitch in wasn't a problem. We also picked off matrix trays, but the BGA's we did had no center array. But if that type are on T&R it should work as well.
Electronics Forum | Tue Oct 26 07:15:10 EDT 1999 | Catherine Mead
Do you know where the sony website is? I've found the general website but not the website for SMT placement machines Thanks
Electronics Forum | Fri Oct 22 11:01:10 EDT 1999 | Eyal Dickerman
SIEMENS introduced recently new feeder made by HOOVER-DEVIS (USA) which will work similar to normal componenet feeder BUT only on SIPLACE machines. Eyal
Electronics Forum | Sat Oct 09 08:35:34 EDT 1999 | Dave F
| Always experiencing dross in pot with different characteristic such as color, shape, dry/wet etc. Any paper, wetsites provide the more comprehesive explanation on its characteristic | "Dross Myth Vesus Fact," R. Woodgate, SMT, 10/98
Electronics Forum | Wed Oct 06 20:46:10 EDT 1999 | Mike Cooper
We have same equipment and used the same adhesive. Switched to Loctite 3618 and problem went away. Check cure profile again. 150C at 90s best. Also, check dot size/patterns. Double dots for chips and 4-dot for SOTs works well for us. Regards.
Electronics Forum | Mon Oct 11 10:49:44 EDT 1999 | ed & tuna
We also had that issue and feel, as Mr wolfgang feels, That handling or packaging may be an issue. The adhesive bond may be partially fractured and releasing in the wavesolder.
Electronics Forum | Thu Sep 16 16:16:16 EDT 1999 | Power Circuits, Inc.
| I am not familiar with the "mil" metric. How many inches is in 1 mil? | | ...or 10 mil? | | 1 mil= .001 inches 10 mil= .010 inches Also, it has nothing to do with metric.
Electronics Forum | Mon Aug 09 10:10:29 EDT 1999 | Gian.D
hello to everybody, we have a really satisfactory no clean process, both smt/reflow and wave soldering, but we get troubles with defects rework; does anybody know how to eliminate flux residues or how not to produce them during rework operations? Th
Electronics Forum | Mon May 10 10:08:16 EDT 1999 | Rich Taylor
Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not?
Electronics Forum | Wed Feb 24 10:56:12 EST 1999 | Steve Schrader
| Under IPC-A-610 Section 10.3(Components on their sides) it reads: | ______________________________________________________ | Acceptable - Class 1,2 | Nonconforming Defect � Class 3 | | Chip components on its side provided the following | are
