Electronics Forum | Thu Oct 24 13:38:49 EDT 2002 | russ
Well I guess this would explain why since reading these posts that when I put a board into the oven it never comes out and there is a funny smell! It was difficult however to get the temp up to 2460 C for 200 seconds. I have never had this extra zer
Electronics Forum | Wed Oct 23 12:22:23 EDT 2002 | slthomas
In a word, no. But your question is interesting...are you a supplier trying to develop wording for a contract, or are you a customer trying to resolve an issue, or? From a customer perspective, I would hope that the healthy charge we pay for low vo
Electronics Forum | Thu Oct 24 09:22:32 EDT 2002 | dscott
We are a supplier building prototypes. Most of our projects consist of boards with array packages down to 30 mil pitch. My concern is with customers that return boards for rework on array packages. Typically if their product is not functioning that i
Electronics Forum | Thu Oct 24 12:09:31 EDT 2002 | slthomas
Have you looked at cross-sectional analysis? If they can provide you details of where the failures are occurring, maybe you can chop one up and see exactly what's going on? We've done it once for our own engineering department and the results (not
Electronics Forum | Tue Oct 22 17:23:35 EDT 2002 | Yannick
Hi, I wondering if someone know the anwser to that. I'm using a solder paste 63/37 and on the solder joint we have a tiny little layer or flux who is like crystalin. I try to play with my profile the get it off but I don't get much success. So D
Electronics Forum | Thu Oct 24 17:32:54 EDT 2002 | ksfacinelli
The big problem we saw was the appearance of the solder joint after the water wash process. We saw the joints turn white through the absorption of moisture. Looked real bad but still functioned. I would stick with using only one of the processes a
Electronics Forum | Tue Oct 29 05:22:38 EST 2002 | kent
Thankyou very much for the information. Another question, what are the difficulty of dealing with the larger ball and tighter pitch? What is size of the ball is consider large and how far the distance for pitch is consider tight? Currently I have
Electronics Forum | Fri Oct 25 16:40:06 EDT 2002 | davef
Nor ment as a criticism of anyone, but you really need to become intimate with your stencil supplier. This is not one of those "throw it over the wall" buying relationships, like you can have with buying pencils. View this an opportunity to develop
Electronics Forum | Fri Oct 25 11:57:34 EDT 2002 | ricardof
Hi, I would like to know what would be the main steps to set-up a COB process? or what would be the main requirements to accomplish this? (eqipment: Die mounter, wire bondig, etc. Documentation: Certifications, etc. Plant readiness: Lay-out, eytc), I
Electronics Forum | Tue Oct 29 11:01:56 EST 2002 | yngwie
Ok..I will refer to the past thread myself....but, just an update, after getting the BGA rebaked ( as I didn't see an evidence from Production saying that they hv baked these batch of BGAs). The shorts are all gone. But one thing thou', if the proble