# 9 10422 results

## Electronics Forum: 10422 (Page 1 of 1)

### minimum solder ball (bead) size

Electronics Forum | Wed Jun 07 21:54:11 EDT 2006 | mumtaz

Ha ha! davef finishes you guys off again!

### minimum solder ball (bead) size

Electronics Forum | Wed Jun 07 22:02:57 EDT 2006 | davef

Similarly, we have eliminated solder balls by using an aqueous washer.

### minimum solder ball (bead) size

Electronics Forum | Wed Jun 07 21:45:53 EDT 2006 | davef

We do not understand the question. Take a deep breath, remember not all of us are trained as geologists. The smallest solder ball we've seen is a little less than 5 nm.

### minimum solder ball (bead) size

Electronics Forum | Thu Jun 08 09:54:07 EDT 2006 | slthomas

Awwww, man. I was looking for something a little less on the anecdotal side for our local municipality's environmental stewards.

### minimum solder ball (bead) size

Electronics Forum | Thu Jun 01 16:30:05 EDT 2006 | slthomas

Just wondering if anyone knows this off the top of there head. I might be able to figure out the math based on surface tension (this is 63/37 so the data is out there) but I REALLY do not want to put that kind of effort into this. :/ Editing to clar

### minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks

IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap

### minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 15:45:18 EDT 2006 | slthomas

Yep. What I'm really looking for is the minimum radius of curvature for 63/37, which is a function of it's surface tension. It's physical properties issue, not an agency issue. I've seen some references that I have interpreted to mean that it's some

### minimum solder ball (bead) size

Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks

In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u

### Re: Micro-BGA soldering

Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L

| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b

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