Electronics Forum: 1112 (Page 1 of 1)

2-sided BGA

Electronics Forum | Tue Jan 30 10:29:08 EST 2001 | sim_ad

How can you do an assembly with BGA on both side?

Mechanical feeders vs Electronic Feeders

Electronics Forum | Tue Jul 21 16:29:44 EDT 2020 | emeto

You have some of the 642s still running? This is impressive. I used to have coupe of these 11-12years ago and I used them for exclusively for simple assemblies with passive components bigger size even back then. Even 0402 was challenge for these base

Information requested

Electronics Forum | Tue Jan 11 15:33:31 EST 2000 | Prawin Paulraj

Hello, I would like to request some information regarding the interfacing of SMT machines. i am of the understanding that it involves some interfaces like SMEMA 1.1,1.2 and SMPI. I would like to know more about the interfacing of machines using these

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton

We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st

Step-up stencil: recommendation thickness

Electronics Forum | Thu May 23 10:18:02 EDT 2019 | emeto

A little hard to tell without knowing your part details and behavior and your PCB design. I have seen part warping so much that will show opens joints on the sides and short in the middle at the same time. Theoretically you should have area ration of

2-sided BGA

Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef

Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature

Ionic - MIL-P-28809A vs IPC TM650 (2.3.25C)

Electronics Forum | Wed Nov 19 13:16:54 EST 2008 | sjpence

Simon, The equivalence factors were used to scale the values measured by ionic testing equipment to the values measured in the standard manual method. There is a good write-up by Bill Kenyon in this Technet Post describing the creating of the facto

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

UltraSonic cleaning machine

Electronics Forum | Wed Sep 25 15:58:36 EDT 2002 | bschreiber

Hello Dave, I hope that electronic slap didn�t hurt too much. Robf, I am sorry that you did not agree with my initial response, but the answer is very detailed and most of the support material I have is only in paper format so I need to either snai


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