Electronics Forum: 139 (Page 1 of 2)

Placement Defect Rate Benchmark

Electronics Forum | Wed Feb 23 16:25:33 EST 2000 | John

We are using a glue and wave solder process for primarily chip components. Our products do not use any fine pitch components. What would an acceptable benchmark for the placement defect rate be? 50 DPMO? 100 DPMO? 200 DPMO? Thanks in advance,

Re: Low-temperature, lead-free solders

Electronics Forum | Tue Apr 20 03:25:21 EDT 1999 | Scott Davies

Joseph, I've heard of a lead free solder alloy, Sn43/Bi57 that melts at 139�C and reflows between 160-170�C. You may find the following website useful. Good Luck Scott

Re: Low-temperature, lead-free solders

Electronics Forum | Tue Apr 20 03:26:57 EDT 1999 | Scott Davies

Joseph, I've heard of a lead free solder alloy, Sn43/Bi57 that melts at 139�C and reflows between 160-170�C. You may find the following website useful: www.cobar.com Good Luck Scott

X-ray X-Tek Harrier 160Xi - breakdown

Electronics Forum | Mon Dec 16 05:05:54 EST 2019 | steven4235

Hello: I want to buy your used Nikon X-Ray, pls reply me email:13560819457@139.com thanks steven

tape and reel vendor

Electronics Forum | Tue Mar 30 10:43:21 EST 2004 | Robert

I could use some help too. I have a bunch of SMD 4 Pads Inductors from Central Technologies. The dimensions of the part is 11.30x13.9x6.9 . I've called four companies already and none were able to find a carrier for this part. These parts are on plas

PCBA Time Estimation Formula

Electronics Forum | Fri Mar 22 12:29:25 EDT 2019 | unisoft

Unisoft ( http://www.unisoft-cim.com / 203-913-0782 ) has software that should help. Here are some links: *** Assembly Cost by Component Span Report for Quoting *** Assembly Cost by Component Span Report for Quoting http://www.unisoft-c

DoE on post-reflow PCB - warp

Electronics Forum | Wed Jun 26 21:05:15 EDT 2002 | ianchan

Hi Dave F, customer calls it "warp", we can call it "twist/bow"..etc. the "warp" occurs on individual PCB cells of 28per each panel. the overall dimension of the panel is 139mm x 168mm, and each individual PCB cell is 2.4mm x 1.2mm. Thickness is 0.

Ionic - MIL-P-28809A vs IPC TM650 (2.3.25C)

Electronics Forum | Wed Nov 19 13:16:54 EST 2008 | sjpence

Simon, The equivalence factors were used to scale the values measured by ionic testing equipment to the values measured in the standard manual method. There is a good write-up by Bill Kenyon in this Technet Post describing the creating of the facto

Re: How to measure N2 in reflow oven

Electronics Forum | Thu Mar 04 08:50:53 EST 1999 | Dave F

I need to setup an oven to run with a nitrogen atmosphere for boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in

Copper Finishes versus Layer Thickness

Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House

Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y

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