Electronics Forum: 146 (Page 1 of 1)

Through Hole Reflow

Electronics Forum | Tue Feb 22 05:50:40 EST 2000 | Arulvanan P

Hi, I am in the process of implemeting Through Hole Reflow. 1.I would to know which are the products/Companies that use that use this process. 2. Is there any reference / standard to convince my QA dept. to accept the boards even though there is no

Source needed for Dehaart Parts... All numbers in forum are NG

Electronics Forum | Mon Dec 20 10:08:52 EST 2004 | mlogic

Hello, I am trying to get hold of frame Hold Down bars for a Dehaart EL20c and all the listed numbers for Dehaart and Lake Madsen are disconnected..... any ideas? I have tied 887-469-3570, 781-270-3285, 781-270-5274, 781-270-3614, 781-272-0794.. Al

modifying a pcb?

Electronics Forum | Sat Mar 19 20:59:57 EST 2005 | nate

i have a bit of a problem. i need a 320x240 lcd with a 5.7" screen, and a max width of 146mm. i have checked with about a dozen manufacturers and 148mm is the smallest they make without custom designing the pcb, and this is prohibitively expensive. w

Re: smt reliability vs thru hole

Electronics Forum | Tue Jan 18 12:36:11 EST 2000 | Dave F

Dave: I haven't located something to support your contention, yet, and I'm not going to comment on the factors that drive reliability beyond component selection, because I know that you've got some sweaty-palmed sales type wringing his hands waiting

Component failure analysis

Electronics Forum | Tue Jul 19 21:24:04 EDT 2005 | davef

This is a bit dated, but it'll give you a starting point. test lab failure analysis IC; Accurel Materials Analysis Group (FIB, FESEM,TEM) 785 Lucerne Dr Sunnyvale, CA 94086; 408-737-3892 Fax 3916 Suzanne Francisco X146 suzannef@accurel.com test la

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R


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