Electronics Forum | Thu Jun 14 08:53:34 EDT 2001 | Brian Sloth Bentzen
Check out the articles on the subject on: www.smtinfocus.com/technical_papers_list.html
Electronics Forum | Mon Jun 11 21:57:55 EDT 2001 | davef
Go to the IPC website [http://ipc.org] and buy "J-STD-012 - Implementation of Flip Chip & Chip Scale Technology".
Electronics Forum | Sun Mar 12 13:09:33 EST 2000 | Jeff Wilson
Jeff, The problem you are describing MAY be related to the push up pin setting on your component feeder units. Please verify that the push up pin height is set correctly for the feeder units, and the nozzle pick-up and placement heights are to the c
Electronics Forum | Tue Sep 12 20:41:12 EDT 2000 | Dave F
Dunno, but maybe one of these taping contractors can give you an answer: V-Tek 214.479.9442fax1630 Surface Mount Taping 408.954.1400fax1470 Cofer 408.526.2050 KBK Electronics 613 S.Market St Lancaster, SC 29720 800.726.1887 803.286.6416 fax283.4115 A
Electronics Forum | Sun Jun 10 20:47:25 EDT 2001 | erichua
Our company is going to start building PCB with flipchip and CSP component. I'm now trying to get more information on the flipchip and CSP process. Because I'm still new to both (flipchip & CSP) and could like to have more information. Can anyone tel
Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Electronics Forum | Thu Jun 01 22:56:58 EDT 2000 | Dave F
CK: Awww, just think how easy this is gonna be to make those others that wouldn't take this on look like whimps. Pass the ketchup please ... Bag the reps, they're good for lunch, but that's about it. Your equipment could have been made by a compa
Electronics Forum | Fri Mar 19 14:24:26 EDT 2010 | davef
See, the bean counters are taking over. They've got you out there counting flyshit. Chip parts aren't worth the time it takes to count them, even with a counterometer. Watch out!!! Next thing they'll have you doing is sweeping-up misplaces, figurin
