Electronics Forum | Tue Jun 08 17:52:53 EDT 1999 | Chrys Shea
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Tue Dec 19 21:33:47 EST 2006 | davef
Job Agencies Adecco 6406 N. IH 35, #1202 Austin, TX 78752 512-794-2944 � tech360@adeccona.com http://www.adeccotechnical.co Aerotek (aka TEKsystems) 12331 Riata Trace Parkway, Bldg 3, #A200 Austin, TX 78727 512-249-4900 � http://www.teksystems.co
