Electronics Forum: 167 (Page 1 of 2)

forum for C167CS processor?

Electronics Forum | Tue Oct 08 03:57:16 EDT 2002 | rsasalm

Hi all, Sorry in advance if the question doestn't see to fit here. I am working on Siemens C167CS microprocessor and looking for a forum where I can send question relating to programming C167CS microprocessor. Thanks in advance regards rsasalm

Cp vs Cpk

Electronics Forum | Fri Jul 04 19:45:50 EDT 2003 | Albert

1.67 to allow the TQM meets company's requirement. good luck, Capone.

IP3 Feeder for large cap.

Electronics Forum | Fri Mar 05 00:53:09 EST 2004 | alwil

I have an Electrolytic capacitor which is 17mm in diameter and is 16.7mm in height. It is presented in a reel,44mm x 24mm. I want to know if there is a suitable feeder available to place this part onto a Fuji IP3. Thanks, Alan.

Conformal Coat Thermal Conductivity

Electronics Forum | Thu Apr 19 14:00:28 EDT 2007 | cecil

Dave, When we converted the Humiseal thermal conductivity info into W/m-*C we came up with .167 - .209. Did we do somthing wrong with our conversion?

Re: Flip Chip with Siplace F 3

Electronics Forum | Fri May 26 05:49:09 EDT 2000 | Richard Wilders

1.67. A lower accuracy will result in many off-pad flipchips; this means a lot of displacements. And there is no chance at all the flipchip will self-center back to the correct placement spot. I think you'll have to evaluate machinery that is capabl

forum for C167CS processor?

Electronics Forum | Tue Oct 08 09:17:13 EDT 2002 | davef

Who knows? Whats does Siemens say? Try: * Embedded Systems Journal http://www.embedded.com/ * RTC http://www.rtcmagazine.com * SEI Web forums at Carnegie Mellon University Software Engineering Institute http://www.sei.cmu.edu/sei-home.html * IEE

Component pad design and volume requirements

Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a

Solder paste height checking

Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami

1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk

Mydata A12 tool tip damage

Electronics Forum | Fri Jul 20 07:25:51 EDT 2007 | chrispy1963

If you still have trouble with this problem try calling MyData and ask their opinion. I know this sounds simple and maybe you have tried already, but I have found in the past that there are certain techs who really know their stuff. Glen Gayton in B

Re: Selecting an SMT Line

Electronics Forum | Thu Sep 17 00:14:09 EDT 1998 | Kevin DeLillo

/= 1.67, the GSMs can handle the complete range of SMC components(0402-QFPs, BGAs, CSP, etc.)PLUS odd form components as well. And if that isn't enough, it can also dispense adhesive or solder paste. Universal's System Group can also put together a

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