Electronics Forum: 16mil qfp mask (Page 1 of 8)

solder mask between qfp pads

Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the

Re: solder mask between qfp pads

Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean

| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon

| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer

| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 16:54:57 EDT 1999 | Scott Cook

| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton

| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w

Re: solder mask between qfp pads

Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F

| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact

Re: solder mask between qfp pads

Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB

| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta

Re: 20 mil qfp bridging

Electronics Forum | Tue Aug 17 10:41:13 EDT 1999 | Steve A

Wayne, Sounds like a gasketing problem. When the horizontal apertures are bleeding but not the vertical apertures. Could be poor underside support, HASL miniscus issues, masking or plugging issues, but what many people do not account for is that t

Re: qfp and soic joint Problem

Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca

All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after

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