New SMT Equipment: 1913mkiii (1)



New Equipment | Reflow

Heller MKIII Series Reflow Ofen Best value SMT Reflow Ovens in the market. Designed for Low Cost of Ownership. Lead Free Certified Enhanced Heater Modules New Flux Management System - Eliminates Maintenance Intuitive Control System Programmab

AssyS GmbH

Electronics Forum: 1913mkiii (1)

new reflow oven - which model/brand/ to choose?

Electronics Forum | Mon Sep 27 06:43:59 EDT 2021 | sophyluo1985

Some thoughts of GOLDLAND: We recommend that you choose Vitronics or Heller brands. They are the most popular machines in the world. According to the long-term plan, your equipment needs maintenance and replacement parts in the future, so their parts

Used SMT Equipment: 1913mkiii (9)

Heller 1913 MKIII

Heller 1913 MKIII

Used SMT Equipment | Soldering - Reflow

Make:  Heller Model: 1913 MKIII Vintage: 2016 Details: • 13 Heating Zones (Top & Bottom) • 3 Cooling Zones Condition:  Complete & Operational - Low Usage 

Lewis & Clark

Heller 1913 MKIII

Heller 1913 MKIII

Used SMT Equipment | Soldering - Reflow

Details: • 13 Top and Bottom zones • Closed Loop • Pin Change • Center board support Condition:  Complete & Operational Location & Shipping:  USA / FOB Origin Availability: Immediate for purchase

Lewis & Clark

Industry News: 1913mkiii (2)

STI Electronics Adds Heller Oven to Its Microelectronics/Cleanroom

Industry News | 2010-04-20 10:30:23.0

MADISON, AL — STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, has added the Heller 1913MKIII Convection Reflow/Curing Oven to its Microelectronics/Cleanroom.

STI Electronics

ACDi Expands Capacity and Capabilities at Its North Carolina Electronics Manufacturing Plant

Industry News | 2021-02-04 09:08:44.0

Growing Demand for Printed Circuit Board Assemblies Prompts Acquisition of New Equipment


Technical Library: 1913mkiii (1)

Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Technical Library | 2017-02-16 16:53:49.0

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.

Auburn University

Partner Websites: 1913mkiii (32)

HELLER 1809MKIII 1913MKIII Board T/C Digitizer Module TDM Heller Insustries


HELLER 1809MKIII 1913MKIII Board T/C Digitizer Module TDM Heller Insustries Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

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High Speed Precision In-Line SPI System - Mirtec MS-11
Reflow Oven

Outstanding liquid dispensing and UV curing, all within one platform, watch the video.
High Throughput Reflow Oven

High Precision Fluid Dispensers
Golden Tech Electronics

Thermal Transfer Materials.