Electronics Forum: 1a33 and deg and c (Page 1 of 2)

lead free and tombstoning

Electronics Forum | Fri Feb 17 11:01:47 EST 2006 | amol_kane

with lead-free solders, one would expect to find less instances of tombstoning. this is because SAC alloys are not eutectic and melt over a range of temp (usually 217-220 deg C) instead of at a single temperature. therefore the forces due to solder s

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb

The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan

Time and temp in lead and lead-free reflow

Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders

Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied

Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan

thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod

Quad ZCR 941 and Lead Free?

Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton

Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be

Lead Free and Leaded Process Mix

Electronics Forum | Fri Jul 08 09:40:28 EDT 2005 | Jason Fullerton

"The only real problem we're seeing is some suppliers trying to use bismuth. That's a big no-no in a SnPb process and we won't accept those parts." Yes and no. Since the SnPbBi tertiary alloy melts at 96 degC, any product rated for storage above tha

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan

Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref

Mix Pb and Pb free alloy

Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir

Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 02:27:43 EDT 2002 | ianchan

Hi mates, does anyone know if there is a industrial standard spec for environment(deg-C, RH%) operational use of Paste Printer machines? If there is no study to define a deg-C, RH% specs for immediate environemnt operation use of a paste printer ma

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