Electronics Forum: 1mm (Page 11 of 29)

New Pick and Place Operation

Electronics Forum | Wed Jun 02 18:28:17 EDT 2004 | russ

I would look at the Samsung CP40 or 45. They have the placement rates you want even a little better on the 40. the 45 will double that easily. They handle all types of parts down to 0201 components. Depending on the camera you select (25mm) you ca

uBGA (.5mm pitch) printing woes

Electronics Forum | Fri Sep 08 01:08:10 EDT 2017 | tsvetan

The material is 0.12mm stainless steel, electropolished it's thick for fine pitch but we have lot of other big components on the board which do not solder good if we use 0.1mm thickness stencil. The 0.3 mm apretures are big enough and have good rele

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F

| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

Oooooh noooooo!!!

Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Wed Mar 16 20:11:03 EST 2005 | darby

KT, What sort of delta T are you getting? This does sound a bit odd. TCs are in EXACTLY the same position on each board? Something I only recently found out - according to Mark Cannon from ERSA re profiling, that you may wish to consider. 1.TCs sho

How to do with tombstoning for component '0402'

Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech

Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch

QFP100 solderability

Electronics Forum | Tue Apr 15 03:16:14 EDT 2008 | janz

Hello, We are having a problem with soldering QFP100 (16mmx16mmx1mm). Board dimensions: 70mmx50mmx1.8. FR4 two layers � single SMT assembly. Finish: HASL-lead free Oven: 7 zones �hot air Paste: lead free We have noticed that two groups of legs

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 00:50:59 EDT 2005 | grantp

Hi, We have a new part we need to mount, and it's a .5 mm pitch BGA with .3 mm diameter pads. That's a lot smaller than we have done before, and we currently use 1 mm pitch BGA's with .5 pads. Has anyone does .5 mm pitch BGA's and what needs to be

Heat sinking delicate leaded parts

Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner

I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei


1mm searches for Companies, Equipment, Machines, Suppliers & Information