Industry News: 1mm (Page 1 of 10)

Hybrid 3dB Mini SMT Couplers

Industry News | 2003-06-17 08:07:40.0

The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.

SMTnet

Best Rated Cost, Flexibility & Technology – MIRTEC’s MV-6 OMNI 3D AOI System at productronica

Industry News | 2017-10-17 19:32:15.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System in Hall A2, Booth 329 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Additionally, the company will show the MS-11e 3D SPI, MV-3 OMNI Desktop 3D AOI and INTELLISYS® software.

MIRTEC Corp

Precision PCB Services, Inc. introduces Nitrogen Capable BGA Rework Station

Industry News | 2017-05-19 13:34:13.0

Precision PCB Services is pleased to announce the addition of a Nitrogen capable BGA Rework Station to their product line.

Precision PCB Services, Inc

Precision PCB Services, Inc. to Demo Zhuomao BGA Rework Station at SMTA Expo, Dallas

Industry News | 2023-03-22 09:50:04.0

Precision PCB Services, Inc. will Demo the Zhuomao ZM-R7220A BGA Rework Station at SMTA Expo, Dallas on March 28th.

Precision PCB Services, Inc

Count On Tools Manufactures MYDATA Midas C24 MicroMelf Nozzles

Industry News | 2011-03-28 11:57:00.0

Count On Tools introduces its new MYDATA Midas C24 MicroMelf Nozzle (L-009-0230). The nozzle is ideal for OD 1 mm MELF components, and features a tool tip radius of 0.5 mm and a tool tip diameter of 2.0 mm. Replacement nozzle tips also are available for this tool in packs of three (D-012-0909).

Count On Tools, Inc.

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

Industry News | 2022-05-05 17:28:46.0

Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste

Nordson Electronics Solutions

Count On Tools Introduces Innovative Solution for Handling BrightKing Gas Discharge Tubes and Melf Components

Industry News | 2023-08-14 12:13:25.0

Count On Tools, Inc. (COT) is pleased to announce its latest advancement in precision component handling – a tailored solution for efficiently handling BrightKing Gas Discharge Tubes and Melf components. This breakthrough solution, part number 2018-3912, is facilitated by the integration of the Custom Yamaha YS12/24 type 318a/307a base and ANE tool stand, enabling customers to achieve precise and reliable pick-and-place operations.

Count On Tools, Inc.

1mm Pitch Discrete Wire System Offers High Reliability

Industry News | 2012-02-17 10:02:53.0

Samtec recently introduced a new 1mm pitch discrete wire system ideal for rugged applications where a highly reliable connection must be maintained. The cable assembly and connector feature a space-saving design and a choice of options to ensure a proper fit.

Samtec, Inc.

Package Converters Enable Testing Generation I product on Generation II System

Industry News | 2010-11-30 13:30:04.0

Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.

Ironwood Electronics

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