Electronics Forum: 2

Storing parts in Mcdry. Can parts stay in bags?

Electronics Forum | Tue Feb 07 05:40:16 EST 2006 | pavel_murtishev

Good day, J-STD-033A: Moisture Sensitivity Levels 5-5a For moisture sensitivity Levels 5 and 5a with floor life exposure not greater than 8 hours, a minimum desiccating period of 10X the exposure time is required to dry the SMD packages en

5% color spot in HIC

Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani

Referring to IPC/JEDEC J-STD-033B.1 section 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef

We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders

I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder


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