Electronics Forum | Fri Feb 16 13:43:07 EST 2007 | ck_the_flip
Hi Darby, Where did you get the info. that cooling rate is not-as-critical for lead-free? I'm not doubting you, and I actually want this to be the case. We don't have chillers on our ovens, and on fast profiles, we only achieve 2 to 2.5 deg. / s c
Electronics Forum | Thu Apr 12 00:25:25 EDT 2007 | raychamp007
Thanks davef! We found some SOIC & QFP with all leads having toe down problem. The heel fillet unable extend to the mid point outside bend. Do you have solutions for the problem? I have a question: How about the normal gull wing lead which is flat &
Electronics Forum | Thu Aug 30 11:02:51 EDT 2007 | gmoritz
... talking two-lead LEDS with 2.5mm pitch ... Yes. That's what we are working with. > are the LED terminals shape were Square or > the naturally rounded? Some are round. Some are square. One is U-shaped. > Due to different insert rotations,
Electronics Forum | Wed Sep 26 17:26:02 EDT 2007 | jax
So far, So good! We are currently standardizing the Lightning Head Advantis as our chip-shooter. We only place chip packages, 0201-1206 with the Lightning Head and everything runs great. We performed qualification testing with components up to 20mm
Electronics Forum | Mon Nov 24 07:36:15 EST 2008 | davef
No, but we find discussions about relative humidity fairly short sighted, because relative humidity is such an imperfect measure of the amount of moisure in the air. Dew point is much more appealing. R.H. = (amount of moisture)/(maximum amount that
Electronics Forum | Tue Dec 16 16:49:22 EST 2008 | scottd3
We ran into this problem before, on all of our models. We never quite found out the reason, we do know that if the PCB is passed through a reflow oven that is extremely dirty with evaporated solder paste flux, it will make it extremely difficult (or
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
Electronics Forum | Tue May 12 10:02:52 EDT 2009 | dwl
I am trying to develop a process for building high environmental temperature PCBs (150-225C) specifically for down hole applications. I'm specifying an evaluation board and was thinking about using polyimide PCBs with Sn05Pb92.5Ag2.5 solder. What so
Electronics Forum | Wed Jun 03 12:02:42 EDT 2009 | joeherz
Greetings, We have a potential job coming up that would require coating with a silicone material (Humiseal 1C51 or equivalent). The volume will be high (in the 1000s/day). This is a low complexity, small card about 2.5" square in a 6up array. Onl
Electronics Forum | Mon Sep 21 00:11:14 EDT 2009 | darrenj
We have a TP9 with a centering motor issue. (TPSYS Ver 2.5.3) The error message F-MOT-SETDYN C/3 Upper endpoint outside limits is shown during C-motor initiation. I've looked in the service program and also the parameters in TPSYS but can find no m
