Electronics Forum: 2

Who has experience in IPC-TM-650 2.6.3.1 Environment test Method

Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee

Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a

Anyone who has experience on IPC-TM650 environment test 2.6.3.1

Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry

Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a

Anyone who has experience on IPC-TM650 environment test 2.6.3.1

Electronics Forum | Wed Nov 12 21:07:47 EST 2003 | davef

Please email us.

GSM camera lens

Electronics Forum | Mon Jan 14 12:28:06 EST 2008 | swag

We are in North Western U.S. I like 2.6 better (for our mix of builds, anyway). 1.0 works great on PTF parts such as fine pitch QFP's but I don't like it for chips. It's too picky and we wind up forcing parts to the 4.0. We have another GSM dual

Please HELP! Need to purchase a few machines

Electronics Forum | Thu Jan 31 14:43:21 EST 2019 | lapskrfc

New York, maybe 2-6 designs in a month.

Test Coupons & Scrap Pieces for Testing Alternative to Oven Baking - IPC TM 650 2.6 2.8

Electronics Forum | Wed Sep 22 21:15:44 EDT 2021 | djenkins62

Hello Everyone: Heat Can Be Very Damaging to Boards and well as extended oven time can cut into valuable production time. Steel Camel is testing ambient temperature drying to remove diffused and embedded moisture in PCBs. We are seeking scrap pie

Test Coupons & Scrap Pieces for Testing Alternative to Oven Baking - IPC TM 650 2.6 2.8

Electronics Forum | Thu Sep 23 15:49:45 EDT 2021 | stephendo

See if there are any board shops near you. One might provide scraps in exchange for name dropping.

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 04:24:39 EDT 2005 | siverts

2.6 mil/pixel and a 4 mil/pixel cameras works maybe even better. It is sometimes a little bit difficult for the 1 mil/pixel cameras to accept parts; and it will take longer time to inspect a bigger QFP as it needs to take more pictures. We use 2.6 mi

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 17:15:34 EST 2000 | Erdem Bilaloglu

We are using semi-circular land pattern and 0.004" smaller appertures on screen. With stable rising slope (max:2.6degC/sec)we have not experienced any tombstonning so far.

Re: Underfilled CSP mechanical test

Electronics Forum | Mon Jun 19 09:54:21 EDT 2000 | Paul Houston

Go to www.ipc.org and click on search. search for: IPC Test Methods Manual Section 6 IPC TM-650 Test Methods Manual SECTION 2.6 - ENVIRONMENTAL TEST METHODS Paul

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