Electronics Forum | Wed Oct 15 08:55:59 EDT 2003 | John
I'm looking at an application that would require 62/36/2 solder paste. We currently run 63/37. I'd like to change across the board to prevent a mix up, but I don't know what concerns/issues that might create. The PCB's we currently run are HASL fi
Electronics Forum | Tue Nov 11 16:07:52 EST 2003 | johnwnz
Folks, has anyone heard fo any problems with RF cards related to solder paste selection. Currently runnign with std SnPb paste but want to move to 2% silver paste. Was asked if this could cause any issues in term's of RF capability or interferance t
Electronics Forum | Wed Nov 12 08:35:16 EST 2003 | davef
2% should have no effect [recognizing that some RF deign implementations are squirrellyand they don't count]. We still use 2% dating back to the old days when the gray beards [at that time] felt that the silver improved skin effect [a tendency for a
Electronics Forum | Sun Feb 15 17:12:15 EST 2004 | brian bennett
as george says move beam back towards the centre of the machine make sure it is square although not neccesarily on the alignment arrows. make sure alignment laser is clean along with the recieving mirror on the head.also make sure the driver filters
Electronics Forum | Mon Nov 17 14:14:15 EST 2003 | blnorman
The main function of the test is to evaluate the solder mask. Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on O
Electronics Forum | Thu Dec 11 20:38:37 EST 2003 | davef
Here is a study on printing factors study on CSP [we understand that you asked about fine pitch, but hey, it's close and FREE] http://nepp.nasa.gov/docuploads/2A524D62-7032-4C0D-BBDED6CFFC2FA07B/SMTA-I-Joint-Paste-2004.pdf It's interesting that whi
Electronics Forum | Mon Dec 15 22:05:02 EST 2003 | Sam
hi Liang, We had the same problem like you before, it happened during starts up the machine (S13) and run the production for the first or second board. We also replaced the 2/2-way microvalve of placement circuit. The problem had solved at the begini
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Wed Mar 10 14:05:29 EST 2004 | dougt
The 400E has a computer on the bottom of the cabinet with a a Serial/Keyboard Card installed in it. J1 pins 19/20 are the cutters transmit/receive lines on this card, they go through a transition brd and on to the Cutter/Processor brd on the side do
Electronics Forum | Fri Mar 19 16:21:26 EST 2004 | davem
Steve is right, Cyberoptics and ASC are the 2 main players in this market. I've used machines produced by both manufacturers and they both do a pretty good jod provided the operators know what they're doing. The LSM and LSM2 are solid but aging mac
