Electronics Forum | Thu Oct 03 10:21:30 EDT 2019 | cbart
Hello all!! we are having a heck of a time getting a TE Connector to solder TE P/N 2305018-2. the part design is terrible!! the parts tips forward and rocks side to side when mounted. we are getting many un-soldered leads. and the design does not len
Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef
From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n
Electronics Forum | Thu Nov 14 12:55:03 EST 2019 | SMTA-Tony
Very late but here's my 2 cents. Will require a custom fixture for every flex or semi-rigid flex. Depending on panel thickness; use 2 tooling hole to fixture on one axis, other tooling holes will have pullers to ensure proper placement. Even with the
Electronics Forum | Fri Nov 15 00:08:01 EST 2019 | ramesh_10377
hi i recommend following actions. 1) check the location where most solder ball is finding 2) verify the printer setting parameter if the problem is still persisting please go below action 1. Stencil thickness should be 4 mil 2. Aperture ope
Electronics Forum | Fri Nov 22 00:09:29 EST 2019 | mk15
I am looking for some help for where to look to fix this MY15E problem. 1. after hardware initiation appear - F-MOT-MOVE X/250: Motor speed out of control (photo1). 2. in service mode when x motor initiate appear - F-MOT-MSETDYN X/12: No axis movemen
Electronics Forum | Mon Dec 23 14:36:16 EST 2019 | tey422
There are times you might want to move the job from one line to another in the middle of the run; ie. machine down. Currently, our SMT is set up like yours, line#2 is just for simple/prototypes jobs. It's easier for us to moves the job from line#1 to
Electronics Forum | Tue Jan 07 02:04:45 EST 2020 | robl
Hi Mikey, Your signal pins (2 & 3) for USB1, 2, & 3 are all connected together so there is no way of splitting the incoming signals from the 3 ports. Normally there would be an IC (a USB hub controller) switching between the signals so that the PC
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Tue Feb 11 12:59:06 EST 2020 | astarotf
Hi Steve Thomas Effectively by IPC-610 standard specifies in the "content 8.2.13 Quad Flat Pack Plastic Package - Without Terminals (PQFN), Table 8-13, page 8-84" which depending on the class of manufacture notes 2-5 of the table, which in theory do
Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
