Electronics Forum | Wed Sep 15 07:34:49 EDT 1999 | Edmund
Hi, Can someone pls suggest to me the best reflow temperature setting for a force air convection oven. The details is as follow. 1) Heller 1700s 2) 12 zone---6 top and 6 bot 3) Solder paste --- Qualitek 691 non clean 4) board size : 159mm X 159mm
Electronics Forum | Tue Sep 07 03:52:50 EDT 1999 | Wolfgang Busko
| My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | My question is what solder temp should be used for this part? | Any advice is appreciated. | THX. | | If you�re un
Electronics Forum | Mon Aug 23 16:54:03 EDT 1999 | M Cox
This is out of the normal scope of this site but� I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Component Identific
Electronics Forum | Tue Aug 24 07:06:28 EDT 1999 | Brian
| This is out of the normal scope of this site but� | | I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Component Ide
Electronics Forum | Mon Aug 23 10:28:51 EDT 1999 | K
You should have no problems with this. Are you thinking of buying one or do you already have one - either way it would be worth upgrading to DeKAlign 4 K | Does anyone have an older DEK 260? I was wondering if a 1995 model 260 with DeKAlign 2 is
Electronics Forum | Wed Aug 04 14:32:02 EDT 1999 | Barney Whalen
| Hi all, | | What is the typical placement head pressure for the GSM1 for placing the micro / chip Scale BGAs ? | | Thanks | Upinder | ======= | Hello Upinder, The typical placement pressure for a GSM1 with Flex head is 150-170 grams. You can p
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Wed Jul 28 20:14:22 EDT 1999 | Dave F
| While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would
Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me
Electronics Forum | Tue Jun 22 08:28:54 EDT 1999 | Jason Gregory
| | I swear I posted it! I smoked an entire cigarette waiting for the damn thing to upload! I'll try it again when I get home tonight. | | | | Sorry for the inconvenience. | | | | | | | regular or filter? | I am having the same trouble. Cannot
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