Electronics Forum: 2.. (Page 761 of 1147)

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Fri Mar 07 14:09:16 EST 2003 | davef

Q1: What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. A1: We've talked about this previously here on SMTnet, for instance check the fine SMTnet Archives: http://www.smtnet.com//forums/index.cfm?fuseactio

Tact Time Estimates

Electronics Forum | Sat Mar 08 02:23:09 EST 2003 | Frank

My two Process Engineers are at odds with each other. One says that the Tact Time is only the actual Pick-n-Place time to build a board, and the other says it needs to include the load/unload time as well as the Fiducial reading time. Example: So

BGA attach eval.

Electronics Forum | Tue Apr 01 17:29:58 EST 2003 | davef

R1: So if I understand you right, it could be possible that gold dissolved, but the ball still didn't wet to the underlying nickel. D1: Correct. The gold dissolves into the solder first. The solder wets to the nickel second. If you nickel is corro

BGA attach eval.

Electronics Forum | Thu Apr 03 09:48:31 EST 2003 | davef

R1: Contacting Altera to find out if the BGA pads are gold. D1: Bet money the pads were ENIG. R2: Contacting Altera to find out if they use abrasives. D2: If abrasives were the problem, you�d see it in many pads, especially those close to the probl

Whitish Solder Joint

Electronics Forum | Fri Apr 04 09:28:59 EST 2003 | davef

Q1: Anyone has any ideas on how this post-SMT reflow solder joint could have changed to whitish joint? A1: Dunno. You need to tell us more. For instance: * What is the appearance of this white residue? [eg, glassy / coarse, milky colored / opaque,

inspection system

Electronics Forum | Tue Apr 15 08:38:23 EDT 2003 | pjc

Don't have any specific links to papers and articles. Try searching on the IPC.org (plus APEX show http://www.goapex.org) and SMTA.org web sites. Any papers and articles on the process from equipment mfg.'s should be taken with a grain of salt. Sold

SMT EQUIPMENT FOR LOW VOLUME HIGH MIX

Electronics Forum | Mon Apr 28 12:29:23 EDT 2003 | hruiz

Hi Jax, I�ve took times, and average, we last from 25 to 40 minutes to load a CP6 depending on how big is the load, but quality guys last other 25 min. per equipment to audit, we usually have 2 CP6 and 1 GSM or 1 CP6 and 2 GSM, at any case, we need t

SMT EQUIPMENT FOR LOW VOLUME HIGH MIX

Electronics Forum | Mon Apr 28 13:29:22 EDT 2003 | gregp

Possibly. It sounds like attrition is a contributor to your problem. Are you recieving the material with the tapes cut from the customer (consignment) or is this something you do in the kitting process? If you are doing it, how do you maintain prop

Wave soldering profiling

Electronics Forum | Tue Jun 10 16:51:19 EDT 2003 | davef

Develop your recipe wave soldering exactly as you developed your recipe for reflow soldering. The only difference is that instead of using your paste supplier's recommendations as the starting point, use your flux supplier's recommendations as a bas

Wave soldering profiling

Electronics Forum | Wed Jun 18 19:26:39 EDT 2003 | gregoryyork

Rules of thumb :- 1. Never over flux - not necessary and waste's money. Never top flux neither 2. Top Board temp. around 70C - 105C or there about's pending what laminate you use. Obviously the more flux you apply the higher heat required/denser PC


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