Electronics Forum | Sat Aug 27 12:45:44 EDT 2005 | Mark
Thanks for the replies. Interesting white paper. Didn't quite answer my concerns but still a good read. I was actually surprised that to test temperature uniformity across the zone, they attached T/C's to the substrate rather than measure the ai
Electronics Forum | Mon Oct 03 22:16:58 EDT 2005 | Ken
If that's the case, let your customer go. I have run into this situation recently. Q. Why do you not run a dedicated line for lead free? A. You (the customer) give less than 12 weeks forcast and expect us to have a dedicated line for your product?
Electronics Forum | Sat Oct 08 00:49:59 EDT 2005 | Mika
We do the following things: 1.) RoHS PCB:s is marked with a code. This is to identify that the PCB:s itself are RoHS compliant. 2.) If it is a true RoHS PCBA; we put a printed label with a green "texture" on the PCBA. 3.) If it is a mixed PB free/PB;
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Wed Nov 16 10:48:23 EST 2005 | aj
Hi, There are a few different types of CP6 which I think the main differences are on the board loading side of things. To briefly answer your questions: 1.What is the actual CPH you are getting during production. There are a lot of variables to c
Electronics Forum | Thu Dec 22 12:05:37 EST 2005 | Tony
Currently we are using a 2 step vapor soldering process to manufacture our std. lead soldered parts. The first step was done with a ls240 vapor fluid and the second was done with a ls200 fluid. Using a 221 deg C sn95/Ag5 solder for the first step a
Electronics Forum | Mon Jan 09 13:11:07 EST 2006 | Joe
I assume you're using a no clean Pb/Sn paste, with a metal squeegee. Here are some generic procedures for good printing results for all pastes. Clean and dry the stencil well using alcohol and vigorously rubbing it with lint free towels, blow it off
Electronics Forum | Mon Feb 13 22:19:48 EST 2006 | Baer
Hi all, I will do my best to answer questions on MS2 here. I will try to check back at least every other day. MS2 is a new process chemical. It is not an oil or powder. It does not leave a residue; it does not mix with the solder. All SIR testing is
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Electronics Forum | Wed Mar 15 17:37:30 EST 2006 | Dan Feinberg
Greetings all, Dross has no value to the assembler. It actually degrades quality as a clean solder pot provides a more consistent process. Yes, removing dross does remove some metallic contaminates but that is overkill, like throwing away your refrig
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