Electronics Forum | Thu May 27 02:02:19 EDT 1999 | Earl Moon
| | Hey peoples, | | We are working with the dairy industry out here and they asked us to start reworking all there boards for them. Of course we said yes, hehe. Only we didn't know what them farmers coated them boards with. It turned out to be wa
Electronics Forum | Fri May 21 12:25:14 EDT 1999 | Dave F
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Tue May 25 09:19:00 EDT 1999 | Ricardo Lopes
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Fri May 21 14:22:56 EDT 1999 | Dave F
| Dave, | i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered
Electronics Forum | Tue May 18 18:17:50 EDT 1999 | Scott Cook
| Looking at the full convection reflow oven market, I see two segments, high mass heater ovens (i.e. Electrovert Omniflow,...), and low mass heater ovens (i.e. Heller,...) | Did some of you guys did some testing on both types and what were your find
Electronics Forum | Wed May 12 23:33:04 EDT 1999 | Matt
WARNING: This is a plug. I have read post on this site where the question is raised: "My machine can do 80 units per hour, but I am only getting 35 - WHY?" Well I have written w95/database code that reads FUJI output files (CPII,CPII,IP2 etc) and d
Electronics Forum | Wed May 05 13:15:43 EDT 1999 | Boca
| Can anyone pls email me a typical temperature profile for wave soldering process. | | Thank you vey much. | | rdgs... | Typical depends on the processes you're developing. Key factors in my experience are flux type and requirements, component
Electronics Forum | Mon May 03 17:23:24 EDT 1999 | Kelly Morris
I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I will b
Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Thu Apr 29 17:38:47 EDT 1999 | JohnW
Ok folk's has anyone used Alpha Metal's UP78 solder paste ? Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. My question's are really : how is the printability of the pas
