Electronics Forum: 2 passes (Page 1 of 43)

manual stencil print 2 passes

Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders

we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi

manual stencil print 2 passes

Electronics Forum | Tue Dec 23 14:45:06 EST 2008 | comatose

One thing that helps is to divide large pads into a series of smaller pads. This prevents the scooping you're talking about.

manual stencil print 2 passes

Electronics Forum | Tue Dec 23 15:06:25 EST 2008 | evtimov

It depends how manual is the printer. you need to control pressure and speed. If you control both by hand, it is difficult to discuss results. If the pressure is controlled by the printer, than you should be able to do it by one deposit. Also is the

manual stencil print 2 passes

Electronics Forum | Wed Dec 24 20:11:43 EST 2008 | xianhua_tang

hi,brettc! Our stencil openings no more than 4mm * 4mm, you have a larger component of the pads is more than a 4*4? At the same time, with the thickness of the stencil, I would like to increase the printing speed can be improved to reduce the thickne

manual stencil print 2 passes

Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef

We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with

intro to 2 sided assembly

Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette

Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The

layer 2 groundplane disconnects after hand solder

Electronics Forum | Fri Apr 10 13:25:08 EDT 2009 | jefflkupkt

Layer 2 is the ground plane layer of a 4 layer board. After installing a 2.5 mm DC power jack and 0.1 center SIP header by hand, the ground pin disconnects and causes an open. My board supplier said they passed Electrical Test. Prepreg was within

layer 2 groundplane disconnects after hand solder

Electronics Forum | Mon Apr 13 12:06:53 EDT 2009 | jefflkupkt

BoardHouse, Thanks for the reply. The board supplier did cover the cost of the bare boards. Five years ago I saw a different part pass ET only to fail at final assembly test as well. One engineer called it "acid trap" on the inner layers where the

Dewetting in Sn Sufrace PCB in 2 Pass Reflow

Electronics Forum | Thu Feb 09 20:12:51 EST 2017 | imarkl

Any advise about dewetting defect occurrence during 2nd pass reflow. Commonality on affected PCB having water marks near affected pad(s). Elemental composition found on affected pads without solder paste are Silicon and Sulfur. As well as in pad with

Pasteprinter | unffilled Pads

Electronics Forum | Tue Feb 14 18:02:02 EST 2023 | cyber_wolf

The slower the squeegee speed the more tendency for "drag out" Raise the print speed and pressure. Rule of thumb 1.5 to 2 LBS squeegee pressure per inch of blade to start. OR try 2 passes with the squeegee.

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