Electronics Forum: 2-11 (Page 1 of 1)


Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Universal GSM1 UPS Rev. 1.4

Electronics Forum | Mon Jun 26 03:00:15 EDT 2000 | armin

Hi, Anybody there running GSM1 UPS Rev 1.4 with OS/2 4.0 Warp ? We have OS/2 2.11 and we plan to upgrade to OS/2 4.0 Warp. I'm afraid of some incompatibility issues might occur. Please feedback any incompatibility issues you encountered in case you h

Bow and twist of PCB's

Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens

Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,

GSM software upgrade

Electronics Forum | Fri May 15 01:44:50 EDT 2009 | dilogic

Since UIC does not support older machines anymore, is there another way to upgrade our GSM1? We have an I-block hardware running OS2.11 and USOS 1.4.14. I would like to upgrade to USOS 3.xx, to be able to use Enhanced Product setup feature. Any hints

OS/2 Warp GSM not playing nice with the network

Electronics Forum | Mon May 18 16:09:37 EDT 2009 | dilogic

I have sucessfully networked our GSM1 into WinXp network using NetBIOS. I was able to access shared folder on the XP server from GSM and we are using that connection for backups and new product imports. Our machine runs on OS/2 V2.11, but I think tha

Universal GSM 2

Electronics Forum | Mon Oct 20 14:56:51 EDT 2014 | rgduval

Progress!! Somehow, this morning I was able to get things almost working. I swapped cards 1 and 2 back, and then back again, so, in the same state as my last reply...set the default settings for the axes configuration...then, verified the addresses

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane

I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of


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