Electronics Forum: 2.3.6 (Page 1 of 1)

share the DFX Design Guideline

Electronics Forum | Tue Oct 13 12:32:43 EDT 2009 | davef

2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes? Page 55, top image is off the page, partially. 2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers

chemical etching

Electronics Forum | Wed Oct 16 13:16:11 EDT 2002 | davef

Hey Mar, Sounds serious!!! Poke around Buehler, Leco, or Struers Try IPC TM-650 Test Methods Manual: 2.3.6A Etching, Ammonium Persulfate Method - 7/75 2.3.7A Etching, Ferric Chloride Method - 7/75 2.3.7.1A Cupric Chloride Etching Method - 12/94

Non wetting spots of flex PCB pads

Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001

I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te

Removing Green Masking on PCB's

Electronics Forum | Thu Jun 14 20:56:02 EDT 2001 | davef

See, now you know how you got the job!!! ;-) Assuming you mean solder mask, that stuff is designed to be tough to remove. It�s an epoxy meant to protect the board features from the ravages of board fabrication and everyday life. Your choices are:

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

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2.3.6 searches for Companies, Equipment, Machines, Suppliers & Information

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