Electronics Forum: 2.4.21 (Page 1 of 1)

Pull Test

Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef

A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen

Solder joint strength

Electronics Forum | Tue Mar 29 09:54:20 EST 2005 | chon

Indy, Please refer to IPC-TM-650 TEST METHOD MANUAL Number, this is the closest written procedure I've found and used for this. I hope helps or if someone has any other input please advise. On more thing I have this file just let me know if

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Solder joint strength

Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef

IPC-TM-650 TEST METHODS MANUAL Number Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Re: Passive component shear Testing

Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F

Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for

Solder joint srength

Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef

Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l


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