Electronics Forum: 2000 (Page 166 of 505)

Repairing Damage To Boards

Electronics Forum | Wed Sep 20 10:38:51 EDT 2000 | Dave F

When an operator using your machine damages a board during rework, how does that damage and the repair required compare with a hot system?

Nonrecurring Cost

Electronics Forum | Mon Sep 18 20:24:25 EDT 2000 | Dave F

What are the non-recurring operating costs of running this machine? How long does it take to program a rework operation, assuming you have CircuitCAM or something like that?

Re: Nonrecurring Cost

Electronics Forum | Thu Sep 21 08:23:52 EDT 2000 | Erick Russell

The temperature is measured with a Pyrometer. It measures the spot that is being heated with the laser. As the surface heats up, the laser power is decreased to stabilize the temperature.

Re: Nonrecurring Cost

Electronics Forum | Thu Sep 21 09:45:42 EDT 2000 | Erick Russell

The pyrometer is a non-contact temperature measuring device. It optically measures the surface temperature of the component surface every 10ms.

Re: Rework Environment

Electronics Forum | Tue Sep 19 13:39:36 EDT 2000 | Dave F

No nozzles!!! Cool!!! We buy nozzles, like jelly beans. In a low volume, high mix shop how does the total cost of ownership match-up with a high-end air rework station?

Why would I want to use photonic soldering for my rework applications?

Electronics Forum | Mon Sep 18 11:29:21 EDT 2000 | aflewelling

Why would I want to use photonic soldering for my rework applications?

Re: Why would I want to use photonic soldering for my rework applications?

Electronics Forum | Mon Sep 18 17:55:55 EDT 2000 | Dave F

Reworking BGA with hot air systems (ie, AirVac, SRT) is fairly complicated and requires fairly rigorous process control. Please compare and contrast BGA rework using hot air and your laser based system.

Bismuth

Electronics Forum | Thu Aug 24 15:35:55 EDT 2000 | jkervin

Hi Dr. Lee, Besides the requirement of a PB free surface finish on PCBs, could you tell me what the pros and cons of a Bismuth bearing solder are? Thanks, Jon Kervin

Indium / Tin Paste Properties

Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F

Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.

reflow profile

Electronics Forum | Thu Aug 24 08:59:38 EDT 2000 | Eugene Smelik

Dr. Lee, For Pb-free solders, will the reflow profile be similar to that of Sn/Pb, with an flux activation plateau before going to peak reflow, or will the profile be more linear in nature? Are there advantages/disadvantages to either profile for P


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