Electronics Forum | Tue May 23 20:37:22 EDT 2000 | Dave F
Gabby: Trying to avoid accusations of plowing new ground eh? Inert soldering: R Curthers et al, "Optimizing A No-Clean Circuit Board Process Using Nitrogen Inerting In A Conventional Wave Solder Machine," NEPCON West 1991 T Walsh, "The benefits Of
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Tue May 23 20:54:44 EDT 2000 | Dave F
Justin: Hey guy you still Mr. Prototype, Small Lot Size? Or have you move on to other things? We either print or dispense goop off-line. May be these guys can help: * TechnoISEL, 2101 Jericho Turnpike, NHyde Park, NY 11040 516.328.3970 fax 8827
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Thu May 18 23:22:44 EDT 2000 | Micah Newcomb
Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, I
Electronics Forum | Mon May 22 12:04:03 EDT 2000 | Michael Parker
80%. There are too many factors at hand to point the finger yet. We need to build a truth table and dot the i's and cross the t's before stepping up to Goliath (Samsung). Is you placement guranteed good? What x-ray have you used? Are your fab.'s know
Electronics Forum | Tue May 23 11:06:53 EDT 2000 | Michael Parker
Kathy- Greater than 88%. Is that 3-D Nicolet? I had a conversation with Arline yesterday, she told me about your trials and tribulations with re-balling. I would like to suggest you try micro-stencil instead. If your BGA rework center has the capabi
Electronics Forum | Thu May 18 20:47:14 EDT 2000 | Dave F
Ed: It might be possible, never tried tho, but if an engineer wandered in, talking about it ... Printing: Makes me pretty nervous, because punched boards are not planar, don�t stay planar, and are inconsistently not planar. If I could work-out th
Electronics Forum | Fri May 19 10:39:19 EDT 2000 | Boca
Ed, I workded with punch and replace fabs yeeeeears ago, major pain! Dave's right, planarity is the biggest problem, then inconsistent retention in the panel, then ANY retention in the panel. If you can get paste on them, you may be able to place
Electronics Forum | Fri May 19 10:41:06 EDT 2000 | Boca
Ed, I workded with punch and replace fabs yeeeeears ago, major pain! Dave's right, planarity is the biggest problem, then inconsistent retention in the panel, then ANY retention in the panel. If you can get paste on them, you may be able to place
