Electronics Forum: 2000 (Page 461 of 505)

Re: the perfect SMT line configuration

Electronics Forum | Sun Oct 01 05:00:08 EDT 2000 | jarnopy

Okay, you have only few different product. Smallest package is 0402 and biggest is 144 pins ic. So, maybe you don't need get high-speed machine. You must place about 12000cmp/hour. You can buy quite cheap placement machine. I can't tell what is good

How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Wed Sep 27 08:50:51 EDT 2000 | Dreamsniper

Hi Guys, I've compared stencil printing adhesive versus acquiring a dispensing equipment. Had breakdown all the costs against each other. It end up that Stencil Printing Adhesive is more costly than equipment dispensing machine in the long term (5 y

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Tue Oct 03 11:07:00 EDT 2000 | C.K.

"In Reality there's no additional cost or extra cost for the cleaning time since there is no increase on operator's wage in doing the cleaning but instead just an additional load or job for the operators at the same wage cost." I'd have to agree...

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Wed Oct 04 14:54:46 EDT 2000 | Sean

I feel Woldgang poses an interesting question. It seems you have already decided that dispensing is the path you wish to take. Yet can you tell us why? Is there a flexibility vs. throughput arguement here? Justification of dispense via the cleani

Re: Capability Study for Solder Printing Process

Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F

Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board

Re: Capability Study for Solder Printing Process

Electronics Forum | Sat Sep 23 15:13:40 EDT 2000 | Francois Racine

Hi Sophia, I`m responsible of SMT line and we solved this problem with a complete automatic solder paste printer machine. In the past we had problem with off alignment and solder height too.... at that time we used a semi-auto printer machine and w

Re: CTE mismatch

Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F

Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections

Re: Floating part at wave.

Electronics Forum | Tue Sep 12 11:55:30 EDT 2000 | Mike F

In general I agree with Dave and Chris, but some parts have leads that can't be clinched (connectors, some header sticks, etc.). If the problem part has not been a floater in the past, then check the lead finish and your flux application. A bad finis

Re: IPC Land Pattern Vs Manufacturer's Recommendation

Electronics Forum | Wed Sep 06 11:18:52 EDT 2000 | Chris May

Randy, I have been with my present company about 14 months and my first and ongoing task is to improve 1st time yield rates at ATE. Upon examination of the failures (14 months ago)there were cases of IC legs being physically wider than the pads on

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va


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