Electronics Forum | Fri May 04 18:24:48 EDT 2001 | ashokdha
I am looking for an IPC Standard (s) or other standard (s) for electronics assemblies. The kind of operations involved are riveting, assembly of backpanels and circuit cards into metal shelf, wire wrap , soldering , contact pins , cabling etc.
Electronics Forum | Mon May 14 18:31:20 EDT 2001 | genny
The experiment was to determine insertions from a > gold plated board into a connector. Same > thickness boards (0.062"), with 100 m base > nickel. � 100m gold =_ 500 insertions � 50 m > gold =_ 300 insertions � 30 m gold =_ 50 to 75 > insertio
Electronics Forum | Wed May 30 10:27:52 EDT 2001 | genny
I couldn't find that standard free on the IPC website and was looking for a quicker answer (hang my head in shame...) Sometimes my company's a little frugal, and to get them to buy a standard can be like pulling hen's teeth... I will see what I can
Electronics Forum | Thu May 31 10:19:04 EDT 2001 | genny
Good news! I put in a request to purchase the spec and it was approved! And then I found out that we recently renewed our IPC membership (I didn't know we ever had one) so we don't even need to pay the nonmember price! Good reading ahead...
Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef
See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6
Electronics Forum | Mon May 07 09:47:11 EDT 2001 | orbotech
All defect types that can not be seen from top view, meaning - any defect which is characterized by more than its top 2D appearance will be hard, if at all possible, to detect by 2D imaging system. This includes: Lifted leads / co planarity J-lead
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Tue May 08 01:01:24 EDT 2001 | ilanl
The AOI suppliers are not tailoring the systems to the application but are defining the applicability of their system to a specific AOI segment �i.e. �leveraging� the limitation of the technology. Would a AOI supplier possess a technology that will a
Electronics Forum | Mon May 07 18:30:23 EDT 2001 | genny
If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and
