Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Tue Jul 17 18:19:09 EDT 2001 | dave
CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF301-00030TOLC�Mount(1,27mm),.050",(0,64mm) .025",micro pitch Looking for someone who has had experience placing this Samtec style of connector .We are having issue with open solder and insufficent. We are no
Electronics Forum | Thu Jul 19 22:52:43 EDT 2001 | davef
Most paste manufacturers talk about a 12 month shelf life for paste. They give the user half of that time. The remainder is used-up in processing and distribution. We'd give it a shot. You paste supplier should be able to give you a much clearer
Electronics Forum | Sat Jul 21 09:27:45 EDT 2001 | davef
No. There's nothing fancy. You need enough solder on the exposed pad for a good thermal connection, but not so much to lift the comonent off the TSSOP pads. We reduce the aperture for the pad, dunno 85%, with four windows [but it doesn't matter ho
Electronics Forum | Sat Jul 21 00:38:46 EDT 2001 | dougk
Where did this come from? I hope our safety director doesn't see this or I'll have more work to do. Seriously, if is bacterial contamination, it would be lysed immediately on contact with the iron. We ask our operators to wash their hands after handl
Electronics Forum | Wed Jul 25 16:26:14 EDT 2001 | CPI
You got it .05 cfm per sqr ft. But that�s the easy part, how are you calculating exchange rate? that�s the tough part. If you want to get it right and keep heating/ac costs down. What I mean is, if you don�t take into account the infiltration and air
Electronics Forum | Sat Jul 21 09:46:41 EDT 2001 | davef
I was reading something in the paper this morning where the police have found that having a witness look at six pictures of suspects laid-out on a table [the six pack method in their parlance] is more error prone than just looking through the stack o
Electronics Forum | Mon Jul 23 13:26:23 EDT 2001 | Hussman
Yes, by the component is a start. There is also board cost, and process material costs, engineering costs if needed, pallet cost if needed, and packaging costs. Inspection and test are another part of the cost. Will you provide your own test-set?
Electronics Forum | Tue Jul 24 20:16:13 EDT 2001 | davef
We don't believe that water is thin enough to clean a uBGA. Given your telecom biz, what cleanliness standard do you use? How do you measure it? And how often do you check it? What are your in-bound materials cleanliness standards? [Oooo, I gues
Electronics Forum | Wed Jul 25 10:46:36 EDT 2001 | Steve
Most of the problems that you will find with NC is visual. I have not found or heard of any real evidence that NC causes component or board failures. The residue has extremely high resistance, which actually gets higher as time goes on. It's a paradi
