Electronics Forum | Tue Sep 18 01:41:23 EDT 2001 | shvetangcd
Hi Jeff, We are having solder-short problems for BGA, QFP, and some other fine pitch parts while using DEK screen printers. The PCB is processed on the second half of the line for screening the side with BGA, QFP, and other fine pitch parts. Which m
Electronics Forum | Tue Sep 18 18:36:59 EDT 2001 | mparker
... and don't forget proper stencil alignment. Invariably I find most bridging problems for fine pitch parts, etc. is caused by lousy alignment. The alignment must be verified under magnification, using the naked eye is not good enough. Use at least
Electronics Forum | Tue Sep 18 13:21:06 EDT 2001 | fcouture
Hello Jeff, I found some good information from what I read until now...so thank you! I have two questions: 1) What finish did you use on the PCB for 0201 ? I think with an aperture so small (12x15mils) tin plated is impossible, what do you think
Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture
Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab
Electronics Forum | Mon Oct 01 09:42:42 EDT 2001 | ac
Darren , I done the HNC in Electrical & Electronic Engineering which was later changed to Mechatronics . The course itself will give you a good broad based grounding in all aspects of E&E Engineering . What you really need to back it up is good quali
Electronics Forum | Fri Oct 05 13:11:42 EDT 2001 | darren jones
hi all thanks very much for the replys...gettin well into the swing of it now...been a few years since i used a calculator properly!!! I also have to do a project which i have to present and write up about. I would like to be able to do something
Electronics Forum | Thu Sep 20 16:51:31 EDT 2001 | jschake
Using an enclosed pressurized printhead system will significantly reduce the waste produced compared to printing glue using squeegees. In trying to stay with the 0201 theme here, I will add that printing glue or adhesive for 0201s continues to be a
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Tue Sep 25 15:11:34 EDT 2001 | Rich Elensky
I have had good experience with the 6500. We used it to inspect both SMD and TH devices. (presence, polarity, correct part) I would suggest you contact CR (now Phton Dynamics) for the latest software. It has some serious improvments over early rel
