Electronics Forum | Thu Feb 22 05:33:51 EST 2001 | mattias
Hello all I just wanted to spread the word regarding the use of sugar to remove burnt-in flux. Dissolve sugar into warm water and spray it on the area that You want to clean,let it work for a short while and rub. If you want to do it the manual wa
Electronics Forum | Thu Feb 22 20:35:38 EST 2001 | davef
Ah, that was the time. Those locomotives chugging down the tracks with a plume of steam and coal dust rising above and dissipating down the track towards the end of the train. "Driving that Train, High on. . ." [http://www.thespoon.com/trainhop/song
Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef
You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the
Electronics Forum | Tue Feb 27 11:28:08 EST 2001 | fkurisu
Hello Mark, It is possible that SolderMask, Inc. could selectively remove the existing solder mask, clean and reapply a Photoimageable solder mask to the BGA area. Mostly likely the mask on your boards is a Liquid Photoimageable Solder Mask (LPIS
Electronics Forum | Fri Mar 02 09:08:10 EST 2001 | markkrmp
Frank, I am not talking about the masking on the PCB. I am actually talking about the masking on the solder side of the BGA. We have a very very high dollar BGA and are trying to reclaim alot for reuse. When we remove the BGA from the assembly, you
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Tue Feb 27 03:35:23 EST 2001 | peterbarton
Steve, I have to support the comments made by Dave F. Provided the surface mount parts on the second side are correctly orientated and not too close to any adjacent through hole leads then the best option has to be to print glue then wave solder. T
Electronics Forum | Tue Feb 27 07:51:59 EST 2001 | jackofalltrades
We use Selective Wave Pallets for the vast majority of our boards with great success. Many of our boards have BGA's and connectors on both sides, which for the most part then require the Selective Wave Pallet. We successfully use pallets up to 10mm t
Electronics Forum | Tue Feb 27 11:25:39 EST 2001 | slthomas
Simply trying to answer a management question: "Can we do bottom side w/o capital expenditures?" If we reflow top and bottom we eliminate the need for dispensing and another oven. Do more with nothing, sort of. Of course the cost in loss of through
Electronics Forum | Mon Feb 26 14:06:09 EST 2001 | marting
We have just started to be involved with collumn grid array devices and are currently placing them by Universal GSM machinery. We have been advised by Universal that they supply "On Axis" cameras designed for visioning CGA devices, however the cost i
.gif)
