Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
Electronics Forum | Thu May 09 17:28:33 EDT 2002 | davef
There is no IPC specification, nor should there be. * There are just too many peculiarities in the design and fabrication of PWB. * The issue is not defining how to store boards. The issue setting expectation for reliable products and allowing you th
Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef
First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu
Electronics Forum | Fri May 17 12:23:38 EDT 2002 | Hussman69
A man in a hot air balloon realized he was lost. He reduced altitude and spotted a woman below. He descended a bit more and shouted, "Excuse me, can you help me? I promised a friend I would meet him an hour ago, but I don't know where I am." The wom
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Wed May 22 13:51:20 EDT 2002 | Phil
2 suggestions - Get a good scope - at least a 4X, but more like a 6X, 10X is best. You have a choice on used equipment for a substantial savings. A Leica Stereo 4 zoom is it. You can look for BGA scopes that have a 90` angle for looking at the balls
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan
Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti
Electronics Forum | Sun May 19 21:01:51 EDT 2002 | ianchan
Hi mates, we only do a double side tape sample for 1st pcs output, buyoff the location vs P/N, and orientation. we can recycle use of "A-items" eg. IC... once all this is affirmed, we mass run the rest of the Lot size, via full SMT line configuratio
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
