Electronics Forum | Thu Aug 21 16:00:51 EDT 2003 | nathan
I agree the Ersa Power tool is probably the most powerful iron on the market, unless you want an iron that takes two hands to hold. We have put the power tool against many irons and none have the capability or power, it should work well for you, and
Electronics Forum | Thu Aug 14 15:46:35 EDT 2003 | dphilbrick
Although DaveF's answer was probably more applicable and there is some really good info on Tin Whiskers it doesn�t really answer the question either from what I saw. I suspect this will become a much larger issue as we all are weaned off of lead!
Electronics Forum | Thu Aug 14 17:29:15 EDT 2003 | Andrea
We use these but we hand solder. The resistor is basically a wire inside the encapsulant. When we noticed the bowing, we tested about 200 that were on different CCA's. They were all fine. If they want to use these under the wave solder, be sure to lo
Electronics Forum | Fri Aug 15 01:31:17 EDT 2003 | Jay
Hi All, I work for a contract manufacturing and we are having a new PCB to build. The PCB has OSP coating on it and it has been sitting open in the production floor for about 15 days. I am not sure weather it will affect the soldering process or not
Electronics Forum | Fri Aug 15 19:52:38 EDT 2003 | Jay
Dave, By Mishandled OSP i meant that it had been touched by bare hands (including pads). Its not like I want to or I donot want to bake these boards. Its just that i want to be sure that the boards will be good to use. And I like your idea to apply
Electronics Forum | Tue Aug 19 09:48:07 EDT 2003 | D Peter
No, we don't have nitro. We may go that way if we can't find decent data from anyone other than the food industry on vacuum drying. I'm just more comfortable with low water/O2 content by removal rather than displacement.
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
Electronics Forum | Wed Aug 20 10:31:41 EDT 2003 | billdampier
We have some new customers that are requiring class 3 IPC standards, and my question is, how would that translate into a labor rate increase as compared to class 2 rates? I'm assuming the labor quote would increase by at least 15-20%, if not more. An