Electronics Forum | Wed Dec 20 04:08:09 EST 2006 | ungun
Sorry for the late reply. I use glue dispenser machine juki kd-775. It have dispensing diameter confirmation unit, but dispensing test tape can be hold for 2 to 3 days a roll if the output 300 pcs pcb with average glue point 100 per peace. Beside, i
Electronics Forum | Wed Dec 20 12:49:06 EST 2006 | paul_bmc
I am looking for white papers or information on what happens to 63/37 solder paste alloys when overheated. I have had some solder joint analysis done regarding missing finish on some of the joints. The analysis came back showing a low lead content
Electronics Forum | Wed Dec 20 20:34:09 EST 2006 | davef
We're not real clear on the issue. [Got ourselves wrapped around lead (Pb) versus lead (termination), we think.] That aside, comments are: * Boiling point of lead [Pb] is [/K]: 2022 [or 1749 �C (3180 �F)] * It's possible that the material that com
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
Electronics Forum | Thu Dec 21 02:27:57 EST 2006 | pavel_murtishev
Good morning, (1) This depends on component type. In general it would be better to have fully populated board. Or at least you should mount components with different thermal mass. You should place TC�s at three points at least: component with high t
Electronics Forum | Thu Dec 21 10:27:24 EST 2006 | realchunks
>>> Now you must take into account your total board mass as well. If you have tons of heat sinks, or parts on the other side that can affect your profile, you should have them on the board when profiling. That�s where the "engineering" part in all
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Thu Dec 21 13:11:25 EST 2006 | SWAG
We have fought with cut-tape way too much. It's always a bad idea. We've tried a couple methods/devices for manual splice with limited success. Before you look into this I would ask them if they could supply you cut tape qty's inslusive of fairly
Electronics Forum | Thu Dec 21 10:20:44 EST 2006 | Mike F
I realize this is not a board assembly question, but I'm hoping some of the people that read this forum can offer some suggestions for me to evaluate. I need a way to mark wire numbers on shrink sleeving that does not have the name Brady anywhere i
Electronics Forum | Fri Dec 29 15:02:33 EST 2006 | bman
We build quite a few cables ourselves, and we go through a lot of heat shrink labels. Unfortunately, we only use Brady heat shrink labels, so I don't know if I can help much. Are you actually running raw heat shrink through your printer? If so, go
