Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Mon Nov 19 09:04:21 EST 2007 | rgduval
We determined moisture more as a diagnosis based on omission. We eliminated the other variables, noted that the parts were cracking in reflow, and deducted that it was trapped moisture. As the moisture expands, the component can be cracked/destroye
Electronics Forum | Mon Nov 19 21:42:51 EST 2007 | jwsmt
I'll e-mail pics to you. Answers to asumptions: * Flex in end-item use was measured at 410 microstrain * Supplier PPM last 12 mos less than 1 * Part goes through 2 reflow cycles; once on top and once on bottom * ICT microstrain was 1365; reduced to
Electronics Forum | Fri Nov 16 08:22:03 EST 2007 | ck_the_flip
For those of you who've completely switched to Pb-Free or who're running in a mixed environment, are you also buying or specifying the "RoHS PCBs" - the ones with * Greater Tg (glass transition temperature) * Thru-holes with limited drill hits and
Electronics Forum | Mon Nov 19 17:40:38 EST 2007 | bbarton
No, the thicker plating and need for very high quality drilling and plating is DUE to the higher copper dissolution rate and higher contact time. As to the Sn100C material, their claims seem to confirm a "lower" copper dissolution rate, but so does A
Electronics Forum | Mon Nov 19 11:14:22 EST 2007 | taintedone
I am currently looking at selective solder machines. The two that i have looked at are the KIss 104 and the APS Novastar SP A400. Both machines are in the price range i need to be in. There are very different from each other as far as how they do the
Electronics Forum | Tue Nov 20 15:06:34 EST 2007 | solder_master
I looked at the Kiss104 and the SPA-400 at the SMTA show in Orlando. I spent an hour with the ACE rep, and walked away totally confused as to how the machine is programmed. I spent 10 minutes with the rep from APS Novastar, and using their Photoscan
Electronics Forum | Tue Nov 20 11:01:05 EST 2007 | dstevenson
Is anyone using a laser to selectively solder components to a board? I'm just starting to research selective soldering methods for the company i work for as we're looking to replace our current hand soldering processes for lead- and lead free- produ
Electronics Forum | Wed Nov 28 17:02:28 EST 2007 | joeherz
We use TraCon's TraBond 2112 for staking applications where larger gaps are involved. It is formulated for PCB staking applications. The material is very low sag and high viscosity. It's 2part and comes in handy bi-paks. Work life is 20-30min.
Electronics Forum | Wed Nov 21 10:15:53 EST 2007 | davef
On one hand, maybe National Aeronautics and Space Administration standards are a good starting point to establish standards for ruggedized manufacturing practice. Look here: http://workmanship.nasa.gov/wkstds_nasa.jsp On the other hand, as you say
