Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Fri Sep 19 11:58:49 EDT 2008 | davef
Four Points supplies materials to stencil fabricators. Four Points, SMT Stencil Supply: Standard Frame Sizes 8" x 10" I.D. Cast Aluminum 12" x 12" I.D. Cast Aluminum 15" x 15" I.D. Cast Aluminum 12" x 17" I.D. Cast Aluminum 15" x 15" I.D. Cast Alu
Electronics Forum | Mon Sep 29 17:45:40 EDT 2008 | dwk
Thanks for all your input. We have investigated 2 options other than the current system. Currently supplying one SSM with N2 via "Canister" system 230L Cryogenic... The options are to increase the reservoir to a fixed 2000L Cryogenic bulk tank syst
Electronics Forum | Fri Oct 03 07:49:19 EDT 2008 | grantp
Hi, I just saw the new NXT machines at globaltronics in Singapore, and mostly they are faster. However what was interesting is Fuji shows a prototype of the new XPF machine, but it was called XPF-W which handles really large PCB's and uses the sam
Electronics Forum | Tue Sep 30 14:14:17 EDT 2008 | ck_the_flip
I've done it 3 different ways in my career (3 different places): 1.) Process Engineering was responsible for solder paste inventory (as well as all other process materials). That was a bad situation due to the blame factor. 2.) TOOL-CRIB control
Electronics Forum | Thu Oct 02 16:22:46 EDT 2008 | davef
Not all paste formulators offer suggestions on handling the storage of opened paste jars, but some do. Here's a couple. Storing Opened Solder Paste Containers * Once a jar or cartridge has been opened it should not be re-refrigerated. If solder past
Electronics Forum | Mon Oct 06 15:17:12 EDT 2008 | davef
Q1: You say that 0.008" of "slop" is un-doable; hence, the reasons for our failures. Any basis for that statement? A1: We're not even considering the accuracy of your placement machine. We base our comments on the gap between the hole and the connec
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Thu Oct 23 09:49:18 EDT 2008 | davef
We're not sure the specifics that BLT Circuit Services Ltd referenced, but many companies use dross reducing agents in their wave solder pots. Among dross reducing agent suppliers: * Fry [4100 Sixth Ave, Altoona, PA 16602; 814-946-1611 F814-944-8094
Electronics Forum | Sat Oct 18 08:17:40 EDT 2008 | hussman
Use a Cpk study on your screen printer. Deviation from print to print. Most reutable surface mount machine companies will supply you with their Cpp study they performed on your machine before they shipped it. On ovens use your profiler. You can
