Electronics Forum: 2010 and laser (Page 1 of 19)

PCB Identification and Tracking

Electronics Forum | Tue May 06 09:38:41 EDT 2003 | blnorman

We use both labels and lasers to mark our boards. Since implementing the lasers, the downtime attributed to bar code labels on those lines have dropped to virtually nothing. We still have problems with the labels wrinkling during reflow making read

Pad and Stencil Design

Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake

A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed

No Clean and Underfill

Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii

Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.

Stencil cleanliness and inspection

Electronics Forum | Thu Jun 07 16:33:22 EDT 2001 | davef

I too know of no product like you desire, but I have a lead for you to follow that might get you further than you're getting now. Call Lumonics [Lumonics, 130 Lombard St, Oxnard, CA 93030 805.485.5559 fax3335 http://www.gsilumonics.com]. They ma

PCB Identification and Tracking

Electronics Forum | Mon May 05 22:24:17 EDT 2003 | jlipton

We are investigating a system, using 2-D matrix code, that will identify and track every PCB throughout our factory, starting from bare board. As a low-medium volume manufacturer, would labels or laser marking be more cost-effective? How difficult is

Pick and Place Machine

Electronics Forum | Sun Nov 25 09:20:38 EST 2012 | mgjme

We use JUKI KE2060 now, and we consider purchase of two YS12 for our next assembly line. But I'm afraid some of the details, like lack of pick-hight measurment function in YS12, we got used to perform at the begining of new production run (by JUKI's

No Clean and Underfill

Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo

No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux

GSM2 and FlexJet heads

Electronics Forum | Fri Mar 19 10:04:51 EDT 2010 | dilogic

Thanks for the explanation - it's hard to get any information from UIC when it comes to the older equipment, so I am stucked to this forum. Can you maybe give me a hint where to ask for such conversion kit?

High-end SPI and AOI?

Electronics Forum | Tue Jan 12 15:54:09 EST 2010 | chupitoone

Hi, Orbotech actually sold it's division to ORPRO Vision. They development of the equipment is still progressing in both their Reflow inspection and SPI systems. Both have newer versions of software released and at the show in SanDiego they demonstr

IP1 and SSOP28

Electronics Forum | Fri May 21 17:36:39 EDT 2010 | m79d

Hi Fujispares thanks for the info but still not going. Tried other ic parts and the result is the same. Also tried another vision board. Any more suggestions? Thanks

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